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Asset Utilization RatioAssets AverageDebt RatioDebt to EquityEBIT MarginEBITDA MarginEBT MarginEnterprise ValueEquity AverageEquity RatioFCF MarginFCF Payout RatioGross MarginInterest Coverage RatioInventory AverageInvested CapitalNet MarginOperating MarginReturn on AssetsReturn on Capital EmployedReturn on EquityReturn on Invested CapitalReturn on SalesTimes Interest Earned

Taiwan Semiconductor Manufacturing (TSM) Interest Coverage Ratio (2016 - 2025)

Taiwan Semiconductor Manufacturing filings provide 16 years of Interest Coverage Ratio readings, the most recent being 45.67 for Q4 2025.

  • On a quarterly basis, Interest Coverage Ratio fell 12.58% to 45.67 in Q4 2025 year-over-year; TTM through Dec 2025 was 49.46, a 40.39% decrease, with the full-year FY2025 number at 158.41, up 25.76% from a year prior.
  • Interest Coverage Ratio hit 45.67 in Q4 2025 for Taiwan Semiconductor Manufacturing, down from 53.68 in the prior quarter.
  • In the past five years, Interest Coverage Ratio ranged from a high of 194.97 in Q1 2021 to a low of 104.54 in Q1 2022.
  • Median Interest Coverage Ratio over the past 5 years was 21.68 (2023), compared with a mean of 3.48.
  • Biggest five-year swings in Interest Coverage Ratio: soared 180.49% in 2021 and later tumbled 274.5% in 2022.
  • Taiwan Semiconductor Manufacturing's Interest Coverage Ratio stood at 33.76 in 2021, then increased by 18.05% to 27.66 in 2022, then grew by 21.61% to 21.68 in 2023, then crashed by 87.05% to 40.56 in 2024, then dropped by 12.58% to 45.67 in 2025.
  • The last three reported values for Interest Coverage Ratio were 45.67 (Q4 2025), 53.68 (Q3 2025), and 40.56 (Q4 2024) per Business Quant data.