Taiwan Semiconductor Manufacturing (TSM) Interest Coverage Ratio (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Interest Coverage Ratio for 17 years, with the latest figure at 242.55 in Q1 2026.

• For the quarter ending Q1 2026, Interest Coverage Ratio rose 259.52% year-over-year to 242.55; the trailing twelve-month figure through Mar 2026 stood at 2047.69 (down 1568.26% YoY), and the FY2025 full-year result was 156.53, up 24.27% from the prior year.
• Interest Coverage Ratio for Q1 2026 stood at 242.55, up from 185.61 in the prior quarter.
• The five-year high for Interest Coverage Ratio was 242.55 in Q1 2026, with the low at 169.23 in Q3 2025.
• Historically, Interest Coverage Ratio has averaged 33.43 across 5 years, with a median of 78.02 in 2023.
• Annual changes were most pronounced in 2023 — Interest Coverage Ratio slumped 174.64% — and 2025, when it soared 705.19%.
• Taiwan Semiconductor Manufacturing's Interest Coverage Ratio stood at 27.66 in 2022, then soared by 422.28% to 89.15 in 2023, then plunged by 74.14% to 23.05 in 2024, then surged by 705.19% to 185.61 in 2025, then jumped by 30.67% to 242.55 in 2026.
• The last three Interest Coverage Ratio figures came in at 242.55 (Q1 2026), 185.61 (Q4 2025), and 169.23 (Q3 2025), per Business Quant data.