Taiwan Semiconductor Manufacturing (TSM) Payables (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Payables for 18 years, with the latest figure at $9.8 billion in Q1 2026.

• For the quarter ending Q1 2026, Payables rose 38.59% year-over-year to $9.8 billion; the trailing twelve-month figure through Mar 2026 stood at $9.8 billion (up 38.59% YoY), and the FY2025 full-year result was $11.7 billion, up 31.12% from the prior year.
• Payables for Q1 2026 stood at $9.8 billion, down from $11.9 billion in the prior quarter.
• The five-year high for Payables was $11.9 billion in Q4 2025, with the low at $4.7 billion in Q1 2023.
• Historically, Payables has averaged $7.3 billion across 5 years, with a median of $7.1 billion in 2023.
• Annual changes were most pronounced in 2023 — Payables sank 54.29% — and 2026, when it jumped 38.59%.
• Taiwan Semiconductor Manufacturing's Payables stood at $6.3 billion in 2022, then gained by 11.87% to $7.1 billion in 2023, then grew by 28.78% to $9.1 billion in 2024, then soared by 30.61% to $11.9 billion in 2025, then fell by 17.01% to $9.8 billion in 2026.
• The last three Payables figures came in at $9.8 billion (Q1 2026), $11.9 billion (Q4 2025), and $8.7 billion (Q3 2025), per Business Quant data.