Taiwan Semiconductor Manufacturing (TSM) Payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has 18 years of Payables data on file, last reported at $13.0 billion in Q1 2026.

• Quarterly Payables rose 37.71% year-over-year to $13.0 billion in Q1 2026, while the trailing twelve-month figure through Mar 2026 was $13.0 billion (up 37.71% YoY) and the FY2025 annual result came in at $11.8 billion, up 31.11% from the prior year.
• Payables improved to $13.0 billion in Q1 2026, from $11.9 billion in the prior quarter.
• In the past five years, Payables ranged from a high of $13.0 billion in Q1 2026 to a low of $6.3 billion in Q1 2023.
• A 5-year average of $8.5 billion and a median of $7.6 billion in 2024 frame the typical range for Payables.
• Annual changes were most pronounced in 2022 — Payables tumbled 39.59% — and 2026, when it surged 37.71%.
• Tracing TSM's Payables over 5 years: stood at $6.6 billion in 2022, then gained by 11.25% to $7.4 billion in 2023, then increased by 23.82% to $9.1 billion in 2024, then jumped by 30.61% to $11.9 billion in 2025, then advanced by 9.09% to $13.0 billion in 2026.
• The last three Payables figures came in at $13.0 billion (Q1 2026), $11.9 billion (Q4 2025), and $11.6 billion (Q3 2025), per Business Quant data.