Taiwan Semiconductor Manufacturing (TSM) Payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Payables for 18 consecutive years, with $14.2 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Payables rose 31.77% year-over-year to $14.2 billion; the trailing twelve-month figure through Jun 2026 stood at $14.2 billion (up 31.77% YoY), and the FY2025 full-year result was $11.9 billion, up 29.32% from the prior year.
• Payables rose to $14.2 billion in Q2 2026 per TSM's latest filing, from $13.0 billion in the prior quarter.
• Across five years, Payables topped out at $14.2 billion in Q2 2026 and bottomed at $6.3 billion in Q1 2023.
• Historically, Payables has averaged $9.3 billion across 5 years, with a median of $8.9 billion in 2024.
• The sharpest annual moves came in 2022 and 2023: Payables soared 71.19% in 2022, then tumbled 47.93% in 2023.
• Over 5 years, Payables stood at $6.4 billion in 2022, then increased by 11.72% to $7.1 billion in 2023, then advanced by 28.51% to $9.1 billion in 2024, then jumped by 30.61% to $11.9 billion in 2025, then advanced by 18.89% to $14.2 billion in 2026.
• According to Business Quant data, Payables over the past three periods registered $14.2 billion, $13.0 billion, and $11.9 billion for Q2 2026, Q1 2026, and Q4 2025 respectively.