Taiwan Semiconductor Manufacturing (TSM) Change in Receivables (2012 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Change in Receivables for 15 consecutive years, with -$2.5 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Change in Receivables fell 1019.0% year-over-year to -$2.5 billion; the trailing twelve-month figure through Jun 2026 stood at -$7.6 billion (down 239.2% YoY), and the FY2025 full-year result was -$266.8 million, up 87.39% from the prior year.
• Change in Receivables grew to -$2.5 billion in Q2 2026 per TSM's latest filing, from -$2.5 billion in the prior quarter.
• Across five years, Change in Receivables topped out at $2.7 billion in Q1 2023 and bottomed at -$2.5 billion in Q1 2026.
• Historically, Change in Receivables has averaged -$684.6 million across 5 years, with a median of -$783.6 million in 2022.
• The sharpest annual moves came in 2025 and 2026: Change in Receivables soared 14958.54% in 2025, then tumbled 1019.0% in 2026.
• Over 5 years, Change in Receivables stood at -$1.0 billion in 2022, then soared by 164.77% to $665.4 million in 2023, then slumped by 423.03% to -$2.1 billion in 2024, then jumped by 87.44% to -$270.0 million in 2025, then plunged by 814.33% to -$2.5 billion in 2026.
• According to Business Quant data, Change in Receivables over the past three periods registered -$2.5 billion, -$2.5 billion, and -$270.0 million for Q2 2026, Q1 2026, and Q4 2025 respectively.