Taiwan Semiconductor Manufacturing (TSM) Total Debt (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Total Debt for 18 consecutive years, with $6.9 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Total Debt rose 62.95% year-over-year to $6.9 billion; the trailing twelve-month figure through Jun 2026 stood at $6.9 billion (up 62.95% YoY), and the FY2025 full-year result was $5.7 billion, up 97.69% from the prior year.
• Total Debt improved to $6.9 billion in Q2 2026 per TSM's latest filing, from $5.5 billion in the prior quarter.
• Across five years, Total Debt topped out at $6.9 billion in Q2 2026 and bottomed at $444.3 million in Q3 2023.
• Historically, Total Debt has averaged $2.8 billion across 5 years, with a median of $2.3 billion in 2024.
• The sharpest annual moves came in 2023 and 2024: Total Debt tumbled 91.45% in 2023, then surged 506.89% in 2024.
• Over 5 years, Total Debt stood at $821.1 million in 2022, then sank by 41.61% to $479.4 million in 2023, then soared by 501.71% to $2.9 billion in 2024, then surged by 99.66% to $5.8 billion in 2025, then increased by 19.95% to $6.9 billion in 2026.
• According to Business Quant data, Total Debt over the past three periods registered $6.9 billion, $5.5 billion, and $5.8 billion for Q2 2026, Q1 2026, and Q4 2025 respectively.