Taiwan Semiconductor Manufacturing (TSM) Liabilities and Shareholders Equity (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Liabilities and Shareholders Equity for 18 years, with the latest figure at $274.1 billion in Q1 2026.

• For the quarter ending Q1 2026, Liabilities and Shareholders Equity rose 26.2% year-over-year to $274.1 billion; the trailing twelve-month figure through Mar 2026 stood at $1003.4 billion (up 25.28% YoY), and the FY2025 full-year result was $252.9 billion, up 23.91% from the prior year.
• Liabilities and Shareholders Equity for Q1 2026 stood at $274.1 billion, up from $255.9 billion in the prior quarter.
• The five-year high for Liabilities and Shareholders Equity was $274.1 billion in Q1 2026, with the low at $142.9 billion in Q1 2022.
• Historically, Liabilities and Shareholders Equity has averaged $192.5 billion across 5 years, with a median of $184.4 billion in 2024.
• Annual changes were most pronounced in 2022 — Liabilities and Shareholders Equity jumped 37.17% — and 2023, when it gained 9.76%.
• Taiwan Semiconductor Manufacturing's Liabilities and Shareholders Equity stood at $158.5 billion in 2022, then advanced by 9.76% to $174.0 billion in 2023, then grew by 19.15% to $207.3 billion in 2024, then gained by 23.44% to $255.9 billion in 2025, then increased by 7.09% to $274.1 billion in 2026.
• The last three Liabilities and Shareholders Equity figures came in at $274.1 billion (Q1 2026), $255.9 billion (Q4 2025), and $246.0 billion (Q3 2025), per Business Quant data.