Taiwan Semiconductor Manufacturing (TSM) Liabilities and Shareholders Equity (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Liabilities and Shareholders Equity for 18 consecutive years, with $274.1 billion the latest figure, recorded in Q1 2026.

• Liabilities and Shareholders Equity for Q1 2026 came in at $274.1 billion, up 26.2% year-over-year; the trailing twelve-month figure through Mar 2026 was $1003.4 billion (up 25.28% YoY), and the FY2025 annual result was $252.9 billion, up 21.97% from the prior year.
• Liabilities and Shareholders Equity was $274.1 billion for Q1 2026 at Taiwan Semiconductor Manufacturing, up from $255.9 billion in the prior quarter.
• Over five years, Liabilities and Shareholders Equity peaked at $274.1 billion in Q1 2026 and troughed at $142.9 billion in Q1 2022.
• Average Liabilities and Shareholders Equity over 5 years is $192.5 billion, with a median of $184.4 billion recorded in 2024.
• Year-over-year, Liabilities and Shareholders Equity jumped 37.17% in 2022 and increased 9.77% in 2023.
• Over 5 years, Liabilities and Shareholders Equity stood at $158.5 billion in 2022, then gained by 9.77% to $174.0 billion in 2023, then gained by 19.15% to $207.3 billion in 2024, then grew by 23.44% to $255.9 billion in 2025, then advanced by 7.09% to $274.1 billion in 2026.
• Per Business Quant data, the three most recent Liabilities and Shareholders Equity figures were $274.1 billion in Q1 2026, $255.9 billion in Q4 2025, and $246.0 billion in Q3 2025.