Taiwan Semiconductor Manufacturing (TSM) Liabilities and Shareholders Equity (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Liabilities and Shareholders Equity for 18 consecutive years, with $296.6 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Liabilities and Shareholders Equity rose 30.44% year-over-year to $296.6 billion; the trailing twelve-month figure through Jun 2026 stood at $1072.6 billion (up 27.22% YoY), and the FY2025 full-year result was $255.2 billion, up 22.22% from the prior year.
• Liabilities and Shareholders Equity grew to $296.6 billion in Q2 2026 per TSM's latest filing, from $274.1 billion in the prior quarter.
• Across five years, Liabilities and Shareholders Equity topped out at $296.6 billion in Q2 2026 and bottomed at $142.9 billion in Q1 2022.
• Historically, Liabilities and Shareholders Equity has averaged $198.3 billion across 5 years, with a median of $184.8 billion in 2024.
• The sharpest annual moves came in 2022 and 2023: Liabilities and Shareholders Equity soared 37.17% in 2022, then grew 9.77% in 2023.
• Over 5 years, Liabilities and Shareholders Equity stood at $158.5 billion in 2022, then climbed by 9.77% to $174.0 billion in 2023, then climbed by 19.15% to $207.3 billion in 2024, then rose by 23.44% to $255.9 billion in 2025, then increased by 15.91% to $296.6 billion in 2026.
• According to Business Quant data, Liabilities and Shareholders Equity over the past three periods registered $296.6 billion, $274.1 billion, and $255.9 billion for Q2 2026, Q1 2026, and Q4 2025 respectively.