Taiwan Semiconductor Manufacturing (TSM) Liabilities and Shareholders Equity (2016 - 2025)
Taiwan Semiconductor Manufacturing filings provide 10 years of Liabilities and Shareholders Equity readings, the most recent being $255.9 billion for Q4 2025.
- On a quarterly basis, Liabilities and Shareholders Equity rose 23.44% to $255.9 billion in Q4 2025 year-over-year; TTM through Dec 2025 was $795.8 billion, a 18.08% increase, with the full-year FY2025 number at $255.2 billion, up 25.03% from a year prior.
- Liabilities and Shareholders Equity reached $255.9 billion in Q4 2025 per TSM's latest filing, up from $207.3 billion in the prior quarter.
- The five-year high for Liabilities and Shareholders Equity was $255.9 billion in Q4 2025, with the low at $134.1 billion in Q4 2021.
- A 5-year average of $186.0 billion and a median of $174.0 billion in 2023 define the central range for Liabilities and Shareholders Equity.
- Year-over-year, Liabilities and Shareholders Equity skyrocketed 38.23% in 2021 and then rose 9.77% in 2023.
- Year by year, Liabilities and Shareholders Equity stood at $134.1 billion in 2021, then rose by 18.24% to $158.5 billion in 2022, then rose by 9.77% to $174.0 billion in 2023, then rose by 19.15% to $207.3 billion in 2024, then rose by 23.44% to $255.9 billion in 2025.
- Per Business Quant, the three most recent readings for TSM's Liabilities and Shareholders Equity are $255.9 billion (Q4 2025), $207.3 billion (Q4 2024), and $174.0 billion (Q4 2023).