Taiwan Semiconductor Manufacturing (TSM) Total Liabilities (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Total Liabilities for 18 consecutive years, with $91.8 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Total Liabilities rose 18.34% year-over-year to $91.8 billion; the trailing twelve-month figure through Jun 2026 stood at $91.8 billion (up 18.34% YoY), and the FY2025 full-year result was $80.9 billion, up 7.43% from the prior year.
• Total Liabilities improved to $91.8 billion in Q2 2026 per TSM's latest filing, from $86.3 billion in the prior quarter.
• Across five years, Total Liabilities topped out at $91.8 billion in Q2 2026 and bottomed at $59.8 billion in Q1 2022.
• Historically, Total Liabilities has averaged $70.9 billion across 5 years, with a median of $66.8 billion in 2024.
• The sharpest annual moves came in 2022 and 2024: Total Liabilities jumped 71.35% in 2022, then dropped 0.42% in 2024.
• Over 5 years, Total Liabilities stood at $65.3 billion in 2022, then rose by 0.03% to $65.4 billion in 2023, then advanced by 14.34% to $74.7 billion in 2024, then climbed by 6.7% to $79.8 billion in 2025, then grew by 15.09% to $91.8 billion in 2026.
• According to Business Quant data, Total Liabilities over the past three periods registered $91.8 billion, $86.3 billion, and $79.8 billion for Q2 2026, Q1 2026, and Q4 2025 respectively.