Taiwan Semiconductor Manufacturing (TSM) Total Liabilities (2016 - 2025)

Taiwan Semiconductor Manufacturing filings provide 10 years of Total Liabilities readings, the most recent being $81.8 billion for Q4 2025.

  • On a quarterly basis, Total Liabilities rose 9.48% to $81.8 billion in Q4 2025 year-over-year; TTM through Dec 2025 was $81.8 billion, a 9.48% increase, with the full-year FY2025 number at $80.9 billion, up 9.9% from a year prior.
  • Total Liabilities reached $81.8 billion in Q4 2025 per TSM's latest filing, up from $74.7 billion in the prior quarter.
  • The five-year high for Total Liabilities was $81.8 billion in Q4 2025, with the low at $56.6 billion in Q4 2021.
  • A 5-year average of $68.8 billion and a median of $65.4 billion in 2023 define the central range for Total Liabilities.
  • Year-over-year, Total Liabilities skyrocketed 74.3% in 2021 and then rose 0.03% in 2023.
  • Year by year, Total Liabilities stood at $56.6 billion in 2021, then grew by 15.4% to $65.3 billion in 2022, then rose by 0.03% to $65.4 billion in 2023, then increased by 14.34% to $74.7 billion in 2024, then increased by 9.48% to $81.8 billion in 2025.
  • Per Business Quant, the three most recent readings for TSM's Total Liabilities are $81.8 billion (Q4 2025), $74.7 billion (Q4 2024), and $65.4 billion (Q4 2023).