Taiwan Semiconductor Manufacturing Co Ltd (TSM) Dividends payables (2019 - 2024)
Taiwan Semiconductor Manufacturing (TSM) has disclosed Dividends payables for 5 consecutive years, with $5.3 billion as the latest value for Q4 2023.
- For the quarter ending Q4 2023, Dividends payables rose 16.42% year-over-year to $5.3 billion, compared with a TTM value of $5.3 billion through Dec 2023, up 16.42%, and an annual FY2023 reading of $5.4 billion, up 12.8% over the prior year.
- Dividends payables was $5.3 billion for Q4 2023 at Taiwan Semiconductor Manufacturing, up from $4.6 billion in the prior quarter.
- Across five years, Dividends payables topped out at $5.3 billion in Q4 2023 and bottomed at $4.3 billion in Q4 2019.
- Average Dividends payables over 5 years is $4.8 billion, with a median of $4.6 billion recorded in 2020.
- The sharpest move saw Dividends payables fell 11.27% in 2022, then rose 16.42% in 2023.
- Year by year, Dividends payables stood at $4.3 billion in 2019, then rose by 6.94% to $4.6 billion in 2020, then increased by 12.68% to $5.1 billion in 2021, then dropped by 11.27% to $4.6 billion in 2022, then grew by 16.42% to $5.3 billion in 2023.
- Business Quant data shows Dividends payables for TSM at $5.3 billion in Q4 2023, $4.6 billion in Q4 2022, and $5.1 billion in Q4 2021.