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Taiwan Semiconductor Manufacturing (TSM) Dividends payables (2016 - 2025)

Taiwan Semiconductor Manufacturing filings provide 14 years of Dividends payables readings, the most recent being $9.2 billion for Q4 2025.

  • On a quarterly basis, Dividends payables rose 34.75% to $9.2 billion in Q4 2025 year-over-year; TTM through Dec 2025 was $9.2 billion, a 34.75% increase, with the full-year FY2025 number at $9.1 billion, up 35.27% from a year prior.
  • Dividends payables hit $9.2 billion in Q4 2025 for Taiwan Semiconductor Manufacturing, up from $8.7 billion in the prior quarter.
  • In the past five years, Dividends payables ranged from a high of $9.2 billion in Q4 2025 to a low of $4.6 billion in Q4 2022.
  • Median Dividends payables over the past 5 years was $5.1 billion (2022), compared with a mean of $5.6 billion.
  • Biggest five-year swings in Dividends payables: dropped 11.27% in 2022 and later soared 34.83% in 2025.
  • Taiwan Semiconductor Manufacturing's Dividends payables stood at $5.1 billion in 2021, then dropped by 11.27% to $4.6 billion in 2022, then grew by 16.42% to $5.3 billion in 2023, then grew by 28.81% to $6.8 billion in 2024, then surged by 34.75% to $9.2 billion in 2025.
  • The last three reported values for Dividends payables were $9.2 billion (Q4 2025), $8.7 billion (Q3 2025), and $6.8 billion (Q4 2024) per Business Quant data.