Taiwan Semiconductor Manufacturing (TSM) Dividends payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has 16 years of Dividends payables data on file, last reported at $9.8 billion in Q1 2026.

• Quarterly Dividends payables rose 38.59% year-over-year to $9.8 billion in Q1 2026, while the trailing twelve-month figure through Mar 2026 was $9.8 billion (up 38.59% YoY) and the FY2025 annual result came in at $9.1 billion, up 35.27% from the prior year.
• Dividends payables advanced to $9.8 billion in Q1 2026, from $9.2 billion in the prior quarter.
• In the past five years, Dividends payables ranged from a high of $9.8 billion in Q1 2026 to a low of $4.6 billion in Q4 2022.
• A 5-year average of $6.3 billion and a median of $5.8 billion in 2024 frame the typical range for Dividends payables.
• Annual changes were most pronounced in 2022 — Dividends payables declined 11.27% — and 2026, when it jumped 38.59%.
• Tracing TSM's Dividends payables over 5 years: stood at $4.6 billion in 2022, then increased by 16.42% to $5.3 billion in 2023, then advanced by 28.81% to $6.8 billion in 2024, then jumped by 34.75% to $9.2 billion in 2025, then advanced by 7.01% to $9.8 billion in 2026.
• The last three Dividends payables figures came in at $9.8 billion (Q1 2026), $9.2 billion (Q4 2025), and $8.7 billion (Q3 2025), per Business Quant data.