Taiwan Semiconductor Manufacturing (TSM) Dividends payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Dividends payables for 17 consecutive years, with $10.7 billion the latest figure, recorded in Q2 2026.

• For the quarter ending Q2 2026, Dividends payables rose 33.34% year-over-year to $10.7 billion; the trailing twelve-month figure through Jun 2026 stood at $10.7 billion (up 33.34% YoY), and the FY2025 full-year result was $9.1 billion, up 32.23% from the prior year.
• Dividends payables climbed to $10.7 billion in Q2 2026 per TSM's latest filing, from $9.8 billion in the prior quarter.
• Across five years, Dividends payables topped out at $10.7 billion in Q2 2026 and bottomed at $4.6 billion in Q4 2022.
• Historically, Dividends payables has averaged $6.5 billion across 5 years, with a median of $5.9 billion in 2024.
• The sharpest annual moves came in 2022 and 2026: Dividends payables fell 11.27% in 2022, then surged 38.59% in 2026.
• Over 5 years, Dividends payables stood at $4.6 billion in 2022, then gained by 16.42% to $5.3 billion in 2023, then grew by 28.81% to $6.8 billion in 2024, then soared by 34.75% to $9.2 billion in 2025, then grew by 16.01% to $10.7 billion in 2026.
• According to Business Quant data, Dividends payables over the past three periods registered $10.7 billion, $9.8 billion, and $9.2 billion for Q2 2026, Q1 2026, and Q4 2025 respectively.