Taiwan Semiconductor Manufacturing (TSM) Dividends payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSM) has reported Dividends payables for 15 consecutive years, with $9.8 billion the latest figure, recorded in Q1 2026.

• Dividends payables for Q1 2026 came in at $9.8 billion, up 38.59% year-over-year; the trailing twelve-month figure through Mar 2026 was $9.8 billion (up 38.59% YoY), and the FY2025 annual result was $9.1 billion, up 35.27% from the prior year.
• Dividends payables was $9.8 billion for Q1 2026 at Taiwan Semiconductor Manufacturing, up from $9.2 billion in the prior quarter.
• Over five years, Dividends payables peaked at $9.8 billion in Q1 2026 and troughed at $4.6 billion in Q4 2022.
• Average Dividends payables over 5 years is $6.3 billion, with a median of $5.8 billion recorded in 2024.
• Year-over-year, Dividends payables retreated 11.27% in 2022 and soared 38.59% in 2026.
• Over 5 years, Dividends payables stood at $4.6 billion in 2022, then advanced by 16.42% to $5.3 billion in 2023, then increased by 28.81% to $6.8 billion in 2024, then jumped by 34.75% to $9.2 billion in 2025, then increased by 7.01% to $9.8 billion in 2026.
• Per Business Quant data, the three most recent Dividends payables figures were $9.8 billion in Q1 2026, $9.2 billion in Q4 2025, and $8.7 billion in Q3 2025.