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Taiwan Semiconductor Manufacturing (TSM) Dividends payables (2019 - 2025)

Taiwan Semiconductor Manufacturing filings provide 7 years of Dividends payables readings, the most recent being $9.2 billion for Q4 2025.

  • On a quarterly basis, Dividends payables rose 34.75% to $9.2 billion in Q4 2025 year-over-year; TTM through Dec 2025 was $9.2 billion, a 34.75% increase, with the full-year FY2025 number at $9.1 billion, up 35.27% from a year prior.
  • Dividends payables reached $9.2 billion in Q4 2025 per TSM's latest filing, up from $6.8 billion in the prior quarter.
  • The five-year high for Dividends payables was $9.2 billion in Q4 2025, with the low at $4.6 billion in Q4 2022.
  • A 5-year average of $6.2 billion and a median of $5.3 billion in 2023 define the central range for Dividends payables.
  • Year-over-year, Dividends payables fell 11.27% in 2022 and then soared 34.75% in 2025.
  • Year by year, Dividends payables stood at $5.1 billion in 2021, then dropped by 11.27% to $4.6 billion in 2022, then increased by 16.42% to $5.3 billion in 2023, then rose by 28.81% to $6.8 billion in 2024, then soared by 34.75% to $9.2 billion in 2025.
  • Per Business Quant, the three most recent readings for TSM's Dividends payables are $9.2 billion (Q4 2025), $6.8 billion (Q4 2024), and $5.3 billion (Q4 2023).