Taiwan Semiconductor Manufacturing (TSM) Land & Improvements (2009 - 2023)

Taiwan Semiconductor Manufacturing (TSM) has reported Land & Improvements for 10 consecutive years, with $1.3 billion the latest figure, recorded in Q1 2023.

• For the quarter ending Q1 2023, Land & Improvements rose 19.01% year-over-year to $1.3 billion; the trailing twelve-month figure through Mar 2023 stood at $1.3 billion (up 19.01% YoY), and the FY2022 full-year result was $1.3 billion, up 4257.72% from the prior year.
• Land & Improvements advanced to $1.3 billion in Q1 2023 per TSM's latest filing, from $1.2 billion in the prior quarter.
• Across five years, Land & Improvements topped out at $1.3 billion in Q1 2023 and bottomed at $14.0 million in Q3 2019.
• Historically, Land & Improvements has averaged $523.5 million across 5 years, with a median of $325.5 million in 2020.
• The sharpest annual moves came in 2020 and 2021: Land & Improvements soared 6180.41% in 2020, then sank 96.63% in 2021.
• Over 5 years, Land & Improvements stood at $14.1 million in 2019, then jumped by 6180.41% to $883.3 million in 2020, then tumbled by 96.63% to $29.8 million in 2021, then soared by 4030.98% to $1.2 billion in 2022, then gained by 3.63% to $1.3 billion in 2023.
• According to Business Quant data, Land & Improvements over the past three periods registered $1.3 billion, $1.2 billion, and $1.1 billion for Q1 2023, Q4 2022, and Q1 2022 respectively.