Taiwan Semiconductor Manufacturing (TSM) Amortizatization of Intangibles (2012 - 2026)

Taiwan Semiconductor Manufacturing has reported Amortizatization of Intangibles for 14 years, with the latest figure at $67.7 million in Q1 2026.

• For the quarter ending Q1 2026, Amortizatization of Intangibles rose 4.12% year-over-year to $67.7 million; the trailing twelve-month figure through Mar 2026 stood at $273.1 million (down 1.6% YoY), and the FY2025 full-year result was $268.2 million, down 5.77% from the prior year.
• Amortizatization of Intangibles for Q1 2026 stood at $67.7 million, down from $68.8 million in the prior quarter.
• The five-year high for Amortizatization of Intangibles was $278.0 million in Q4 2022, with the low at $65.0 million in Q1 2025.
• Historically, Amortizatization of Intangibles has averaged $83.8 million across 5 years, with a median of $72.5 million in 2022.
• Annual changes were most pronounced in 2022 — Amortizatization of Intangibles rose 12.79% — and 2023, when it sank 73.19%.
• Taiwan Semiconductor Manufacturing's Amortizatization of Intangibles stood at $278.0 million in 2022, then slumped by 73.19% to $74.5 million in 2023, then declined by 4.01% to $71.6 million in 2024, then declined by 3.83% to $68.8 million in 2025, then fell by 1.68% to $67.7 million in 2026.
• The last three Amortizatization of Intangibles figures came in at $67.7 million (Q1 2026), $68.8 million (Q4 2025), and $70.1 million (Q3 2025), per Business Quant data.