Taiwan Semiconductor Manufacturing (TSM) Amortizatization of Intangibles (2018)

Taiwan Semiconductor Manufacturing (TSM) has reported Amortizatization of Intangibles for 14 consecutive years, with $67.7 million the latest figure, recorded in Q1 2026.

• Amortizatization of Intangibles for Q1 2026 came in at $67.7 million, up 4.12% year-over-year; the trailing twelve-month figure through Mar 2026 was $273.1 million (down 1.6% YoY), and the FY2025 annual result was $268.2 million, down 5.77% from the prior year.
• Amortizatization of Intangibles was $67.7 million for Q1 2026 at Taiwan Semiconductor Manufacturing, down from $68.8 million in the prior quarter.
• Over five years, Amortizatization of Intangibles peaked at $279.6 million in Q4 2022 and troughed at $65.0 million in Q1 2025.
• Average Amortizatization of Intangibles over 5 years is $83.9 million, with a median of $72.5 million recorded in 2022.
• Year-over-year, Amortizatization of Intangibles advanced 12.79% in 2022 and sank 73.34% in 2023.
• Over 5 years, Amortizatization of Intangibles stood at $279.6 million in 2022, then tumbled by 73.34% to $74.5 million in 2023, then decreased by 4.01% to $71.6 million in 2024, then decreased by 3.83% to $68.8 million in 2025, then slipped by 1.68% to $67.7 million in 2026.
• Per Business Quant data, the three most recent Amortizatization of Intangibles figures were $67.7 million in Q1 2026, $68.8 million in Q4 2025, and $70.1 million in Q3 2025.