Taiwan Semiconductor Manufacturing (TSMWF) Total Liabilities (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Total Liabilities for 18 years, with the latest figure at $86.3 billion in Q1 2026.

• For the quarter ending Q1 2026, Total Liabilities rose 12.02% year-over-year to $86.3 billion; the trailing twelve-month figure through Mar 2026 stood at $86.3 billion (up 12.02% YoY), and the FY2025 full-year result was $80.9 billion, up 9.9% from the prior year.
• Total Liabilities for Q1 2026 stood at $86.3 billion, up from $79.8 billion in the prior quarter.
• The five-year high for Total Liabilities was $86.3 billion in Q1 2026, with the low at $59.8 billion in Q1 2022.
• Historically, Total Liabilities has averaged $69.6 billion across 5 years, with a median of $66.8 billion in 2023.
• Annual changes were most pronounced in 2022 — Total Liabilities soared 71.35% — and 2024, when it slipped 0.42%.
• Taiwan Semiconductor Manufacturing's Total Liabilities stood at $65.3 billion in 2022, then grew by 0.03% to $65.4 billion in 2023, then rose by 14.34% to $74.7 billion in 2024, then gained by 6.7% to $79.8 billion in 2025, then advanced by 8.26% to $86.3 billion in 2026.
• The last three Total Liabilities figures came in at $86.3 billion (Q1 2026), $79.8 billion (Q4 2025), and $77.6 billion (Q3 2025), per Business Quant data.