Taiwan Semiconductor Manufacturing (TSMWF) Total Liabilities (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSMWF) has reported Total Liabilities for 18 consecutive years, with $86.3 billion the latest figure, recorded in Q1 2026.

• Total Liabilities for Q1 2026 came in at $86.3 billion, up 12.02% year-over-year; the trailing twelve-month figure through Mar 2026 was $86.3 billion (up 12.02% YoY), and the FY2025 annual result was $80.9 billion, up 9.9% from the prior year.
• Total Liabilities was $86.3 billion for Q1 2026 at Taiwan Semiconductor Manufacturing, up from $79.8 billion in the prior quarter.
• Over five years, Total Liabilities peaked at $86.3 billion in Q1 2026 and troughed at $59.8 billion in Q1 2022.
• Average Total Liabilities over 5 years is $69.6 billion, with a median of $66.8 billion recorded in 2023.
• Year-over-year, Total Liabilities surged 71.35% in 2022 and declined 0.42% in 2024.
• Over 5 years, Total Liabilities stood at $65.3 billion in 2022, then gained by 0.03% to $65.4 billion in 2023, then climbed by 14.34% to $74.7 billion in 2024, then grew by 6.7% to $79.8 billion in 2025, then increased by 8.26% to $86.3 billion in 2026.
• Per Business Quant data, the three most recent Total Liabilities figures were $86.3 billion in Q1 2026, $79.8 billion in Q4 2025, and $77.6 billion in Q3 2025.