Taiwan Semiconductor Manufacturing (TSMWF) Payables (2009 - 2026)

Taiwan Semiconductor Manufacturing (TSMWF) has reported Payables for 18 consecutive years, with $13.0 billion the latest figure, recorded in Q1 2026.

• Payables for Q1 2026 came in at $13.0 billion, up 37.65% year-over-year; the trailing twelve-month figure through Mar 2026 was $13.0 billion (up 37.65% YoY), and the FY2025 annual result was $11.7 billion, up 29.06% from the prior year.
• Payables was $13.0 billion for Q1 2026 at Taiwan Semiconductor Manufacturing, up from $11.9 billion in the prior quarter.
• Over five years, Payables peaked at $13.0 billion in Q1 2026 and troughed at $6.2 billion in Q1 2023.
• Average Payables over 5 years is $8.9 billion, with a median of $8.6 billion recorded in 2024.
• Year-over-year, Payables slumped 48.23% in 2023 and soared 37.65% in 2026.
• Over 5 years, Payables stood at $6.3 billion in 2022, then grew by 11.87% to $7.1 billion in 2023, then gained by 28.78% to $9.1 billion in 2024, then surged by 30.61% to $11.9 billion in 2025, then advanced by 9.14% to $13.0 billion in 2026.
• Per Business Quant data, the three most recent Payables figures were $13.0 billion in Q1 2026, $11.9 billion in Q4 2025, and $11.5 billion in Q3 2025.