Taiwan Semiconductor Manufacturing (TSMWF) Dividends payables (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Dividends payables for 15 years, with the latest figure at $9.8 billion in Q1 2026.

• For the quarter ending Q1 2026, Dividends payables rose 38.59% year-over-year to $9.8 billion; the trailing twelve-month figure through Mar 2026 stood at $9.8 billion (up 38.59% YoY), and the FY2025 full-year result was $9.1 billion, up 35.27% from the prior year.
• Dividends payables for Q1 2026 stood at $9.8 billion, up from $9.2 billion in the prior quarter.
• The five-year high for Dividends payables was $9.8 billion in Q1 2026, with the low at $4.6 billion in Q4 2022.
• Historically, Dividends payables has averaged $6.3 billion across 5 years, with a median of $5.8 billion in 2024.
• Annual changes were most pronounced in 2022 — Dividends payables declined 11.27% — and 2026, when it jumped 38.59%.
• Taiwan Semiconductor Manufacturing's Dividends payables stood at $4.6 billion in 2022, then increased by 16.42% to $5.3 billion in 2023, then advanced by 28.81% to $6.8 billion in 2024, then jumped by 34.75% to $9.2 billion in 2025, then advanced by 7.01% to $9.8 billion in 2026.
• The last three Dividends payables figures came in at $9.8 billion (Q1 2026), $9.2 billion (Q4 2025), and $8.7 billion (Q3 2025), per Business Quant data.