Taiwan Semiconductor Manufacturing (TSMWF) Dividends payables (2019 - 2024)
Taiwan Semiconductor Manufacturing's Dividends payables history spans 6 years, with the latest figure at $6.8 billion for Q4 2024.
- For Q4 2024, Dividends payables rose 28.81% year-over-year to $6.8 billion; the TTM value through Dec 2024 reached $6.8 billion, up 28.81%, while the annual FY2024 figure was $6.7 billion, 22.12% up from the prior year.
- Dividends payables reached $6.8 billion in Q4 2024 per TSMWF's latest filing, up from $5.3 billion in the prior quarter.
- In the past five years, Dividends payables ranged from a high of $6.8 billion in Q4 2024 to a low of $4.6 billion in Q4 2022.
- Average Dividends payables over 5 years is $5.3 billion, with a median of $5.1 billion recorded in 2021.
- Peak YoY movement for Dividends payables: fell 11.27% in 2022, then grew 28.81% in 2024.
- A 5-year view of Dividends payables shows it stood at $4.6 billion in 2020, then rose by 12.68% to $5.1 billion in 2021, then decreased by 11.27% to $4.6 billion in 2022, then rose by 16.42% to $5.3 billion in 2023, then grew by 28.81% to $6.8 billion in 2024.
- Per Business Quant, the three most recent readings for TSMWF's Dividends payables are $6.8 billion (Q4 2024), $5.3 billion (Q4 2023), and $4.6 billion (Q4 2022).