Taiwan Semiconductor Manufacturing (TSMWF) Dividends Paid - Common (2009 - 2026)

Taiwan Semiconductor Manufacturing has reported Dividends Paid - Common for 15 years, with the latest figure at -$4.1 billion in Q1 2026.

• For the quarter ending Q1 2026, Dividends Paid - Common fell 29.94% year-over-year to -$4.1 billion; the trailing twelve-month figure through Mar 2026 stood at $16.2 billion (down 45.95% YoY), and the FY2025 full-year result was $14.9 billion, up 34.39% from the prior year.
• Dividends Paid - Common for Q1 2026 stood at -$4.1 billion, down from $28.0 billion in the prior quarter.
• The five-year high for Dividends Paid - Common was $28.0 billion in Q4 2025, with the low at -$4.1 billion in Q1 2026.
• Historically, Dividends Paid - Common has averaged $3.2 billion across 5 years, with a median of -$2.4 billion in 2022.
• The largest YoY upside for Dividends Paid - Common was 45.34% in 2025 against a maximum downside of 38.68% in 2025.
• Taiwan Semiconductor Manufacturing's Dividends Paid - Common stood at $15.9 billion in 2022, then climbed by 4.91% to $16.7 billion in 2023, then grew by 15.33% to $19.3 billion in 2024, then soared by 45.34% to $28.0 billion in 2025, then slumped by 114.64% to -$4.1 billion in 2026.
• The last three Dividends Paid - Common figures came in at -$4.1 billion (Q1 2026), $28.0 billion (Q4 2025), and -$3.9 billion (Q3 2025), per Business Quant data.